DX300多線切割機 （可來料/代加工） 產(chǎn)品簡介 Produsts Introduction 本機型為我公司專門為切割半導(dǎo)體硅片設(shè)計的一款機型，應(yīng)用金剛石線切割，大切割幅面為Φ300mm （12 英寸）。該設(shè)備具有精 密溫度控制系統(tǒng)，切片精度高，翹曲度小，切片質(zhì)量穩(wěn)定，切割成本低。 This series is specially designed for cutting semiconductor silicon wafers. The maximum cutting width is Φ300 mm (12 inches) with diamond wire cutting. It has a precise temperature  control system, high slice precision, small warpage, stable slice quality and low cutting cost. 切割樣品 Cutting sample 機型特點Characteristics